Apparatus and method for increasing heat dissipation capacity of a medical instrument

ABSTRACT

A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is coupled between the elongate member and the housing. The heat pump device is configured to transfer thermal energy between the elongate member and the housing.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application62/503,521 filed May 9, 2017, which is incorporated by reference hereinin its entirety.

FIELD

The present disclosure is directed to medical instruments and, inparticular, medical instruments that generate heat. More particularly,the present disclosure is directed to systems and methods for increasingthe heat dissipation capacity along a medical instrument, such as anendoscope.

BACKGROUND

Minimally invasive imaging instruments may be used for visual inspectionof hard-to-reach or compact spaces within a patient's anatomy. Anendoscope is an example of a minimally invasive imaging instrument thatmay include a shaft having a distal tip that can be inserted into thepatient's body. A housing may be connected to the other end of theshaft. The housing may contain, for example, various optical componentsand electronic components that allow a human operator to view and/orrecord images captured at the distal tip of the shaft. The endoscope mayprovide illumination to the inspected anatomic area.

It may be desirable to improve image quality and power efficiency of theimaging instrument by locating some of the optical and electroniccomponents near the distal tip of the shaft. With existing systems, suchimprovements have been limited by the need to maintain a distal tipanatomic contact temperature that is below a maximum contact temperaturetypically set by safety regulations. The maximum contact temperature maybe, for example, the highest temperature at which the distal tip cansafely come into direct contact with or within a selected range of aninternal body part or patient tissue. Thus, improved systems and methodsfor maintaining the distal tip at a temperature equal to or below themaximum contact temperature may be desired.

SUMMARY

The embodiments of the invention are summarized by the claims thatfollow below.

In one illustrative embodiment, an apparatus comprises an elongatemember, a housing, and a heat pump device. The elongate member has adistal end and a proximal end. The housing is coupled to the proximalend of the elongate member. The heat pump device is coupled between theelongate member and the housing. The heat pump device is configured totransfer thermal energy between the elongate member and the housing.

In another illustrative embodiment, an apparatus comprises an elongatemember, a housing, and a heat pump device. The elongate member has adistal end and a proximal end. The housing is coupled to the proximalend of the elongate member. The heat pump device is coupled to at leastone of the elongate member and the housing. The heat pump device isconfigured to change a first heat dissipation capacity of the elongatemember and to change a second heat dissipation capacity of the housing.

In yet another illustrative embodiment, an apparatus comprises anelongate member, a housing, and a plurality of heat pump devices. Theelongate member has a distal end and a proximal end. The housing islocated near the proximal end of the elongate member. Each of theplurality of heat pump devices is located at a respective one of aplurality of positions along a heat path formed between the distal endof the elongate member and the housing. The plurality of heat pumpdevices transfers thermal energy to change a first heat dissipationcapacity of the elongate member and to change a second heat dissipationcapacity of the housing.

In still yet another illustrative embodiment, a method is provided.Thermal energy is generated at a distal end of an elongate member. Thethermal energy is transferred between the elongate member and a housingcoupled to a proximal end of the elongate member by activating a heatpump device thermally coupled between the elongate member and thehousing.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory innature and are intended to provide an understanding of the presentdisclosure without limiting the scope of the present disclosure. In thatregard, additional aspects, features, and advantages of the presentdisclosure will be apparent to one skilled in the art from the followingdetailed description.

BRIEF DESCRIPTIONS OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion. In addition, the present disclosuremay repeat reference numerals and/or letters in the various examples.This repetition is for the purpose of simplicity and clarity and doesnot in itself dictate a relationship between the various embodimentsand/or configurations discussed.

FIG. 1 is an illustration of an imaging system in accordance with anillustrative embodiment;

FIG. 2 is an illustration of a schematic view of an imaging system inaccordance with an illustrative embodiment;

FIG. 3 is an illustration of a method for improving heat dissipationcapacity in accordance with an illustrative embodiment;

FIG. 4 is an illustration of a method for improving heat dissipationcapacity in accordance with an illustrative embodiment; and

FIG. 5 is a graph of tip and housing heat dissipation capacities versuselongate member and housing temperatures in accordance with anillustrative embodiment.

DETAILED DESCRIPTION

In the following description, specific details are set forth describingsome embodiments consistent with the present disclosure. Numerousspecific details are set forth in order to provide a thoroughunderstanding of the embodiments. It will be apparent, however, to oneskilled in the art that some embodiments may be practiced without someor all of these specific details. The specific embodiments disclosedherein are meant to be illustrative but not limiting. One skilled in theart may realize other elements that, although not specifically describedhere, are within the scope and the spirit of this disclosure. Inaddition, to avoid unnecessary repetition, one or more features shownand described in association with one embodiment may be incorporatedinto other embodiments unless specifically described otherwise or if theone or more features would make an embodiment non-functional. In someinstances well known methods, procedures, components, and circuits havenot been described in detail so as not to unnecessarily obscure aspectsof the embodiments.

The illustrative embodiments recognize and take into account that it maybe desirable to have an apparatus and method for dissipating the heatgenerated by the operation of components at the distal end of a medicalinstrument, such as an endoscope. The heat may be transferred from thedistal end to a housing that is located outside of a patient's body. Theheat may then be sunk into the ambient environment around the housing.The illustrative embodiments recognize that various factors may limitthe heat dissipation capacity at the distal end of the endoscope. Thesefactors may include, for example, without limitation, the maximumcontact temperature of the distal tip, the ambient temperature of theambient environment, and the thermal resistances of the electrical andmechanical parts located between the distal tip and the housing. Thus,the illustrative embodiments provide an apparatus and method forincreasing the tip heat dissipation capacity and the housing heatdissipation capacity in the context of these limiting factors.

The illustrative embodiments described below provide a method andapparatus for increasing the heat dissipation capacity at various areasof interest along a medical imaging instrument, such as an endoscope. Inone illustrative embodiment, an apparatus comprises an elongate member,a housing, and a heat pump device. The elongate member has a distal endand a proximal end. The housing is coupled to the proximal end of theelongate member. The heat pump device is coupled between the elongatemember and the housing. The heat pump device is configured to transferthermal energy between the elongate member and the housing. Thistransfer of thermal energy may include the heat dissipation capacitiesof the distal end and the housing. In particular, using the heat pumpdevice may allow the heat from the distal end to be dissipated throughthe housing without needing to change the ambient temperature andwithout adding an undesired amount of weight or bulk to the endoscope.

Further, increasing the heat dissipation capacities at the distal endand housing may allow components that generate heat to be used at ornear the tip without a temperature at the distal end exceeding themaximum contact temperature. For example, one or more illuminationcomponents, one or more electronic components, or a combination thereofmay be relocated at or near a tip at the distal of the endoscope toimprove the image quality, power efficiency, and robustness of theendoscope. In particular, moving these components towards the tip mayhelp simplify the optics, thereby reducing the overall weight of theendoscope.

Referring to FIG. 1 of the drawings, an imaging system 100 is depictedin accordance with an illustrative embodiment. The imaging system 100may be an instrument that can be used to visually and medically inspectvarious internal body parts and cavities inside a patient's anatomy. Forexample, the imaging system 100 may take the form of an endoscope usedto provide views of the internal parts of a patient's anatomy.

In one illustrative embodiment, the imaging system 100 includes anelongate member 102, a housing 106, and a heat pump device 108.Depending on the implementation, the elongate member 102 may be rigid,flexible, articulated, partially flexible, or a combination thereof.Further, the elongate member 102 may be comprised of metal, plastic, acombination of the two, or some other suitable material. As oneillustrative example, the elongate member 102 may take the form of ashaft having one or more internal passageways. The elongate member 102may have a thermal resistance selected to help improve heat dissipation.

During a medical procedure in which the imaging system 100 is used tovisualize an internal patient anatomy, a portion of the elongate member102 may be inserted inside the patient's anatomy, while another portionof the elongate member 102 may be kept outside of the patient's anatomy.For example, without limitation, a first portion 110 of the elongatemember 102 may be located inside the patient's anatomy, while a secondportion 112 may be located outside the patient's anatomy.

The elongate member 102 has a distal end 114 and a proximal end 116. Adistal tip 104 of the shaft is located at the distal end 114. In oneillustrative embodiment, the tip 104 may be an integral part of theelongate member 102. In other illustrative embodiments, the tip 104 maybe a separate part that is coupled to the elongate member 102.

The housing 106 is located near the proximal end 116 of the elongatemember 102. In this illustrative embodiment, the housing 106 may beindirectly coupled to the proximal end 116 of the elongate member 102via the heat pump device 108. The housing 106 may contain any number ofdifferent components. For example, without limitation, the housing 106may contain one or more optical elements that allow a human operator toview images captured at the distal end 114 of the imaging system 100.These optical components may include, for example, without limitation,one or more mirrors, one or more lenses, one or more other opticalcomponents, or a combination thereof. Depending on the implementation,the housing 106 may contain additional components.

Further, the housing 106 may be comprised of one or more materialsselected to improve heat dissipation. In one illustrative embodiment,the housing 106 is comprised of aluminum.

The imaging system 100 also includes a component 117 located at thedistal end 114. The component 117 may generate thermal energy thatcauses the temperature of the distal end 114 to increase. In someillustrative embodiments, the component 117 takes the form of a lightemitting diode (LED) or another type of powered light source orillumination source that generates thermal energy. In other illustrativeembodiments, the component 117 may be a powered electronic component,such as a sensor or a signal transmitter, which generates thermalenergy. In alternative embodiments where the thermal energy generatingcomponent 117 is omitted, the heat dissipation systems described hereinmay also be used to dissipate body heat or otherwise cool the distal end114.

The distal end 114, and therefore the tip 104, has a maximum contacttemperature (T_(C)) that is considered safe for when the distal end 114comes into direct contact with or within a selected range of an internalbody part or patient tissue. In one illustrative example, this selectedrange may be between about 2 millimeters and about 10 millimeters. Themaximum contact temperature for the distal end 114 may be regulated bysafety standards. As one illustrative example, the maximum contacttemperature may be a value between about 40 degrees Celsius and 45degrees Celsius. In other illustrative examples, the maximum contacttemperature may be a value between about 40 degrees Celsius and about 50degrees Celsius. Accordingly, the temperature of the distal end 114 mayneed to be controlled to ensure that the distal end 114 does not reach atemperature above the maximum contact temperature.

In this embodiment, the temperature of the distal end 114 may becontrolled by dissipating the thermal energy generated by the component117 along a main heat path from the tip 104 and into an ambientenvironment 118 around the housing 106. As one illustrative example, theheat may be transferred from the tip 104 at the distal end 114, alongthe elongate member 102, then spread to the housing 106, and finallydissipated from the housing 106 into the ambient environment 118.

The ambient environment 118 may have an ambient temperature (T_(A)). Insome instances, the ambient temperature may be variable. For example,without limitation, the ambient environment 118 may be an operating roomin a hospital or clinic. In some instances, the operating room may bemaintained at a temperature selected between about 18 degrees Celsiusand 23 degrees Celsius. Depending on the type of ambient environment118, the ambient temperature may be maintained at a value between about18 degrees Celsius and about 28 degrees Celsius.

The main heat path has an overall system temperature difference (ΔT_(O))that is bounded by the maximum contact temperature (T_(C)) for thedistal end 114 and the ambient temperature (T_(A)) of the ambientenvironment 118. For example, when the maximum contact temperature isbetween about 40 degrees Celsius and 45 degrees Celsius and the ambienttemperature is between about 23 degrees Celsius and 26 degrees Celsius,the overall system temperature difference may be between about 16degrees Celsius and 20 degrees Celsius.

The heat pump device 108 accelerates the transfer of heat along the mainheat path. In this embodiment, the heat pump device 108 is positionedbetween the elongate member 102 and the housing 106. More specifically,the heat pump device 108 may be coupled to the proximal end 116 of theelongate member 102 at one side of the heat pump device 108 and coupledto a distal side 107 of the housing 106 at an opposite side of the heatpump device 108. In this manner, the elongate member 102 may beindirectly coupled to the housing 106 through the heat pump device 108.

The heat pump device 108 is used to increase a heat dissipation capacityof the elongated member 102 and a heat dissipation capacity of thehousing 106. In particular, the heat pump device 108 may increase theheat dissipation capacity of the elongated member 102 and the heatdissipation capacity of the housing 106 to accelerate overall heatdissipation along the main heat path and accelerate removal of heat fromthe distal end 114. The heat dissipation capacity of the elongate membermay also be referred to as a tip heat dissipation capacity, a distal endheat dissipation capacity, or an elongate member heat dissipationcapacity. The heat dissipation capacity of the housing may also bereferred to as a housing heat dissipation capacity.

FIG. 2 is a schematic view of the imaging system 100. In thisillustrative embodiment, the heat pump device 108 takes the form of athermoelectric cooler. But in other illustrative embodiments, othertypes of devices that transfer thermal energy (i.e., heat) from a sourceof heat to a heat sink may be used.

As depicted, the heat pump device 108 has a shaft side 200 and a housingside 202. In this illustrative embodiment, the shaft side 200 isthermally coupled to the elongate member 102 and the housing side 202 isthermally coupled to the housing 106. The heat pump device 108 allows atemperature (T₁) of the proximal end 116 of the elongate member 102 tobe controlled at a level lower than the ambient temperature of theambient environment 118. Further, the heat pump device 108 allows atemperature (T₂) of the distal side 107 of the housing 106 to becontrolled at a level higher than the maximum contact temperature forthe distal end 114.

For example, when the ambient temperature is set to about 25 degreesCelsius, the temperature T₁ of the elongate member may be maintained atabout 20 degrees Celsius with the operation of the heat pump device 108.Further, the heat pump device 108 controls the temperature T₂ of thedistal side 107 housing 106 at substantially a value that is higher thanthe maximum contact temperature for the distal end 114. For example,without limitation, when the maximum contact temperature is set to about42 degrees Celsius, the resulting temperature T₂ may be about 50 degreesCelsius. In this manner, the difference between the temperature T₂ andtemperature T₁, which may be about 30 degrees Celsius, is greater thanthe overall system temperature difference (T_(C)−T_(A)) of about 17degrees Celsius.

Accordingly, the proximal end 116 of the elongate member 102 may have atemperature, controlled by the heat pump device 108, lower than thetemperature of the housing 106. Further, the shaft side 200 of the heatpump device 108 may have a temperature lower than the housing side 202of the heat pump device 108. The heat pump device 108 allows heat to betransferred from the cooler elongate member 102 at the shaft side 200 tothe warmer housing 106 at the housing side 202. Thus, the heat pumpdevice 108 accelerates the heat transfer between the elongate member 102and the housing 106.

In one illustrative embodiment, external power supplied to operate ofthe heat pump device 108 generates waste heat. The heat pump device 108may also be capable of dissipating this waste heat through the housing106. When the difference between the heat dissipation capacity of thehousing 106 and the heat dissipation capacity of the elongate member 102is greater than the rate at which the waste heat is generated, thehousing 106 may be capable of dissipating the heat from both theelongate member 102 and the heat pump device 108. In one example, theheat dissipation capacity of the housing 106 achieved using the heatpump device may be about 7 Watts. The heat dissipation capacity of theelongate member 102 achieved using the heat pump device 108 may be about3 Watts. If the rate at which the waste heat is generated by the heatpump device 108 is less than about 4 Watts, then the housing 106 mayeffectively dissipate the heat from both the distal end 114 and the heatpump device 108.

The illustrations in FIGS. 1 and 2 are not meant to imply physical orarchitectural limitations to the manner in which the differentillustrative embodiments may be implemented. Other components inaddition to or in place of the ones illustrated may be used. Somecomponents may be optional.

In some illustrative embodiments, a heat pump system including aplurality of heat pump devices may be used along the main heat path ofthe imaging system 100. For example, a plurality of heat pump devicesmay be located at a plurality of positions along the main heat path toaccelerate thermal energy transfer at each position, thereby increasingthe heat dissipation capacity of the elongate member 102 and the heatdissipation capacity of the housing 106. The plurality of heat pumpdevices may create a plurality of selected temperature differences atthe plurality of positions along the main heat path. Collectively orindividually, the plurality of selected temperature differences at therespective position in the plurality of positions may be greater thanthe overall system temperature difference. Accordingly, the thermalenergy, or heat, transferred at each of the plurality of positions isincreased.

FIG. 3 is an illustration of a method for improving heat dissipationcapacity, depicted in accordance with an illustrative embodiment. Themethod 300 illustrated in FIG. 3 may be used to improve the heatdissipation capacity along a medical instrument, such as the elongatemember 102 between the tip 104 and the housing 106 of the imaging system100 described in previous figures. The method 300 is illustrated as aset of operations or processes 302 and 304. Not all of the illustratedprocesses 302 and 304 may be performed in all embodiments of method 300.Additionally, one or more processes that are not expressly illustratedin FIG. 3 may be included before, after, in between, or as part of theprocesses 302 and 304. In some embodiments, one or more of the processes302 and 304 may be optional and therefore omitted.

The method 300 may begin with a process 302 that includes generatingthermal energy at a distal end of an elongate member. In process 302,the thermal energy may be generated by operating a powered component ator near the distal end. For example, without limitation, heat may begenerated by operation of an illumination source, such as a lightemitting diode at or near the distal end. In another example, heat maybe generated by operation of an electronic component at or near thedistal end.

At process 304, a heat pump device is activated. The heat pump may bethermally coupled between the elongate member and the housing.

At process 306, the thermal energy is transferred between the elongatemember and the housing. Thus, the use of the heat pump may increase theheat dissipation capacity of the elongate member and the heatdissipation capacity of the housing, as compared to a similar systemthat omits the heat pump device. Accordingly, the heat pump device mayallow more powerful components to be used at or near the distal tip, ascompared to when the heat pump device is omitted. In one illustrativeembodiment, the heat pump device may be a thermoelectric cooler.Depending on the implementation, the thermal energy may be transferredfrom the elongate member to the housing, from the housing to theelongate member, or both.

In greater detail, the heat pump device may control a temperature of theelongate member at a shaft side of the heat pump device. In someillustrative embodiments, the heat pump device may control the shaftside temperature at a level that is lower than an ambient temperature.Further, the heat pump device may control a temperature of the housingat a housing side of the heat pump device. In some illustrativeembodiments, the heat pump device may control the housing sidetemperature at a value that is higher than a maximum contact temperatureof the distal end 114.

FIG. 4 is an illustration of a method for improving heat dissipationcapacity, depicted in accordance with an illustrative embodiment. Themethod 400 illustrated in FIG. 4 may be used to improve the heatdissipation capacity of an imaging system such as an endoscope. Themethod 400 is illustrated as a set of operations or processes 402-410.Not all of the illustrated processes 402-410 may be performed in allembodiments of method 400. Additionally, one or more processes that arenot expressly illustrated in FIG. 4 may be included before, after, inbetween, or as part of the processes 402-410. In some embodiments, oneor more of the processes 402-410 may be optional and therefore omitted.

The method may begin with a process 402 that includes inserting a distalend of an endoscope inside a patient anatomy. At process 404, anillumination source located at the distal end of the endoscope isactivated. The illumination source may be, for example, a light emittingdiode. Activating the light emitting diode may include, for example,supplying power to the light emitting diode. In this example, heat isgenerated at the distal end of the endoscope in response to activationof the light emitting diode.

At process 406, heat generated at the distal end of the endoscope isconveyed along a shaft of the endoscope. At process 408, the heat istransferred from the shaft to a housing of the endoscope through a heatpump device. The heat pump device may increase the shaft heatdissipation capacity and the housing dissipation capacity. In process408, the housing is located outside of the patient's anatomy.

In process 408, the heat pump device maintains a shaft side temperatureat a value below an ambient temperature of the ambient environmentaround the housing. Further, the heat pump device may be used tomaintain the housing side temperature at a value above a maximum contacttemperature for the distal end 114 of the endoscope. Accordingly, theheat pump device creates a temperature difference between the shaft andthe housing that is greater than the overall system temperaturedifference between the distal end 114 and the ambient environment,thereby increasing the heat dissipation capacity of the shaft and theheat dissipation capacity of the housing. In other illustrativeembodiments, the heat pump device may be used to maintain the housingside temperature at a value below the maximum contact temperature forthe distal end 114 of the endoscope but above the ambient temperature.

At process 410, the heat is dissipated from the housing into an ambientenvironment around the housing. This type of dissipation may also bereferred to as sinking the heat into the ambient environment.

FIG. 5 is a graph 500 of tip and housing heat dissipation capacitiesversus elongate member and housing temperatures, depicted in accordancewith an illustrative embodiment. The graph 500 illustrates how using theheat pump device 108 of the imaging system 100 in FIG. 1 can increasethe heat dissipation capacity of the elongate member 102 and thus thedistal end 114 and also the housing heat dissipation capacity of thehousing 106 in FIG. 1.

The graph 500 includes a temperature axis 502, a tip heat dissipationcapacity axis 504, and a housing heat dissipation capacity axis 506. Thetemperature axis 502 identifies temperature values in degrees Celsius.The tip heat dissipation capacity axis 504 identifies heat dissipationcapacity values for the tip 104 at the distal end 114 in Watts. Thehousing heat dissipation capacity axis 506 identifies heat dissipationcapacity values for the housing 106 in Watts.

The graph 500 also includes a line 508, a line 510, a line 512, a line514, and a line 516. In this illustrative example, the first line 508represents the heat dissipation capacity of the elongate member 102 ofthe imaging system 100 when the elongate member 102 has a thermalresistance of about 6 degrees Celsius per Watt. The second line 510represents the heat dissipation capacity of the elongate member 102 ofthe imaging system 100 when the elongate member 102 has a thermalresistance of about 10 degrees Celsius per Watt. The third line 512represents the heat dissipation capacity of the elongate member 102 ofthe imaging system 100 when the elongate member 102 has a thermalresistance of about 15 degrees Celsius per Watt.

Further, the first housing line 514 represents the heat dissipationcapacity of the housing 106 of the imaging system 100 when the housingis comprised of aluminum. The second housing line 516 represents theheat dissipation capacity of the housing 106 of the imaging system 100when the housing is comprised of stainless steel.

In this illustrative embodiment, the housing 106 may have a length ofabout 120 millimeters and a thermal transmittance of about 30 Watts permeter-squared-Kelvin (W/m²K). The ambient temperature of the ambientenvironment 118 around the housing 106 may be set to about 27 degreesCelsius. Further, the maximum contact temperature for the distal end114, and therefore the tip 104, may be about 42 degrees Celsius. Thus,the overall system temperature difference may be the difference betweenthe maximum contact temperature and the ambient temperature, which isabout 15 degrees Celsius.

Using the heat pump device 108 between the elongate member 102 and thehousing 106, the temperature of the elongate member 102 is decoupledfrom the temperature of the housing 106 at heat pump device 108. Forexample, the heat pump device 108 may be used to keep the elongatemember 102 at a lower temperature than the ambient temperature and tokeep the housing 106 at a higher temperature than the maximum contacttemperature for the distal end 114.

As illustrated by the point 518 along the line 510, when the housing 106is made of aluminum and the elongate member has a thermal resistance ofabout 6 degrees Celsius per Watt, the heat pump device 108 may be usedto maintain the shaft side temperature at about 25 degrees Celsius.Further, as indicated by the point 520 along the line 514, the heat pumpdevice 108 may be used to maintain the housing side temperature at about50 degrees Celsius. Thus, the temperature difference created between theelongate member 102 and the housing 106 may be about 25 degrees Celsius,which is greater than the overall system temperature difference.

By creating this larger temperature difference between the elongatemember 102 and the housing 106, the heat pump device may increase thetip heat dissipation capacity to about 3 Watts and the housingdissipation capacity to about 7 Watts. If the heat pump device generateswaste heat at a rate less than the 4-Watt difference between the housingand tip heat dissipation capacities, the heat pump device may be able todissipate the heat from both the tip and the waste heat from the heatpump device.

As indicated by the intersection 522 of the first line 510 and the line514, without the heat pump device 108, the elongate member 102 and thehousing 106 would have a temperature of about 35 degrees Celsius at thejoint between the elongate member 102 and the housing 106. Further,without the heat pump device 108, the tip dissipation capacity wouldonly be about 1.33 Watts and the housing dissipation capacity would onlybe about 2.37 Watts.

Thus, the illustrative embodiments provide a method and apparatus forimproving heat dissipation capacities along a medical instrument, suchas an endoscope. Improving the tip and housing heat dissipationcapacities allows components that generate a greater amount of heat tobe used at or near the tip of endoscope. For example, higher-poweredlight emitting diodes may be used at the tip of the endoscope to providebetter illumination without exceeding the maximum contact temperature ofthe tip or needing to redesign the housing or change the ambienttemperature.

Further, using a thermoelectric cooler as the heat pump device may notadd any undesired weight or bulk to the endoscope. Additionally, using athermoelectric cooler may ensure that additional undesired acoustic orelectrical noise is not produced during operation of the endoscope.

While certain exemplary embodiments of the invention have been describedand shown in the accompanying drawings, it is to be understood that suchembodiments are merely illustrative of and not restrictive on the broadinvention. Additionally, it is to be understood that the embodiments ofthe invention are not limited to the specific constructions andarrangements shown and described, since various other modifications mayoccur to those ordinarily skilled in the art.

Further, in the detailed description of the embodiments of theinvention, numerous specific details have been set forth in order toprovide a thorough understanding of the disclosed embodiments. However,it will be obvious to one skilled in the art that the embodiments ofthis disclosure may be practiced without these specific details. In someinstances, well known methods, procedures, and components have not beendescribed in detail so as not to unnecessarily obscure aspects of theembodiments of the invention.

1. An apparatus comprising: an elongate member having a distal end and aproximal end; a housing coupled to the proximal end of the elongatemember; and a heat pump device coupled between the elongate member andthe housing, the heat pump device configured to transfer thermal energybetween the elongate member and the housing.
 2. The apparatus of claim1, wherein the heat pump device comprises: a first side coupled to theproximal end of the elongate member; and a second side coupled to thehousing.
 3. The apparatus of claim 2, wherein the heat pump devicecontrols a first temperature of the elongate member at the first side ofthe heat pump device such that the first temperature is lower than anambient temperature around the housing.
 4. The apparatus of claim 2,wherein the heat pump device controls a second temperature of thehousing at the second side of the heat pump device such that the secondtemperature is higher than a maximum contact temperature of the distalend of the elongate member.
 5. The apparatus of claim 2, wherein theheat pump device dissipates a waste heat generated by the heat pumpdevice through the housing.
 6. The apparatus of claim 2, wherein theheat pump device is configured to transfer thermal energy from theelongate member to the housing such that a proximal end temperature ofthe proximal end of the elongate member is less than a housingtemperature of the housing.
 7. The apparatus of claim 1, wherein theheat pump device includes a thermoelectric cooler.
 8. The apparatus ofclaim 1 wherein the distal end of the elongate member includes a heatgenerating device that generates the thermal energy.
 9. (canceled) 10.An apparatus comprising: an elongate member having a distal end and aproximal end; a housing coupled to the proximal end of the elongatemember; and a heat pump device coupled to at least one of the elongatemember and the housing, the heat pump device configured to change afirst heat dissipation capacity of the elongate member and to change asecond heat dissipation capacity of the housing.
 11. The apparatus ofclaim 10, wherein the heat pump device comprises: a first side coupledto the proximal end of the elongate member; and a second side coupled tothe housing.
 12. The apparatus of claim 11, wherein the heat pump devicecontrols a first temperature of the elongate member at the first side ofthe heat pump device such that the first temperature is lower than anambient temperature around the housing.
 13. The apparatus of claim 11,wherein the heat pump device controls a second temperature of thehousing at the second side of the heat pump device such that the secondtemperature is higher than a maximum contact temperature of the distalend of the elongate member.
 14. The apparatus of claim 10, wherein theheat pump device causes a first temperature of the elongate member to bemaintained at substantially a first value that is lower than an ambienttemperature around the housing and causes a second temperature of thehousing to be maintained at substantially a second value that is higherthan a maximum contact temperature of the distal end of the elongatemember.
 15. The apparatus of claim 10, wherein the heat pump deviceprovides dissipation of a waste heat generated by the heat pump devicewhen a rate at which the waste heat is generated is less than adifference between the second heat dissipation capacity and the firstheat dissipation capacity.
 16. The apparatus of claim 10, wherein theheat pump device transfers heat from the elongate member to the housingsuch that a proximal end temperature of the proximal end of the elongatemember is less than a housing temperature of the housing.
 17. Theapparatus of claim 10, wherein the heat pump device includes athermoelectric cooler.
 18. The apparatus of claim 10, wherein the distalend of the elongate member includes a heat generating device thatchanges the first heat dissipation capacity of the elongate member andchanges the second heat dissipation capacity of the housing. 19.(canceled)
 20. An apparatus comprising: an elongate member having adistal end and a proximal end; a housing located near the proximal endof the elongate member; and a plurality of heat pump devices eachlocated at a respective one of a plurality of positions along a heatpath formed between the distal end of the elongate member and thehousing, wherein the plurality of heat pump devices transfer thermalenergy to change a first heat dissipation capacity of the elongatemember and to change a second heat dissipation capacity of the housing.21. The apparatus of claim 20, wherein collectively the plurality ofheat pump devices create an internal temperature difference and whereinthe internal temperature difference is greater than an overall systemtemperature difference.
 22. The apparatus of claim 21, wherein theoverall system temperature difference is bounded by a maximum contacttemperature of the distal end of the elongate member and an ambienttemperature of an environment around the housing. 23-29. (canceled)